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CuNi3Si Copper Alloy

CuNi3Si

  • ENCW112C
  • ENCuNi3Si1Mg
  • DIN2.0857
  • UNSC70250

Precipitation-hardening nickel-silicon copper alloy. A beryllium-free alternative offering good strength, hardness and electrical / thermal conductivity.

01Material Properties

  • Beryllium-free
  • Precipitation hardened: ~180–230 HB
  • Electrical conductivity ~40–50 % IACS
  • Good thermal conductivity
  • Good wear resistance and machinability

02Applications

  • Resistance welding electrode holders and arms
  • Plastic injection mold cores and cooling components
  • Connectors and spring contacts
  • Continuous casting mold components
  • High-strength conductive parts

03Delivery Condition

  • Precipitation-hardened rod and plate (TH04 / solution treated + aged).

04Heat Treatment

Typical values

Solution treatment
900–950 °C; water quench
Ageing
450–500 °C, 2–3 h
After ageing
≈ 180–230 HB
Electrical conductivity
≈ 40–50 % IACS
Delivery condition
Solution treated + aged (TH04)

Heat treatment cycle (schematic)

02004006008001000Solution treat925°1. Solution treat — 925 °C2. Quench — 25 °CAge475°3. Age — 475 °C4. Cool — 25 °CTime (schematic, not to scale)°C
Stages and temperatures are typical values; soaking times depend on section size.

Ageing diagram (approximate)

5010015020025001002003004005006007000 °C → 85 HB400 °C → 170 HB450 °C → 205 HB475 °C → 215 HB500 °C → 210 HB550 °C → 185 HB600 °C → 145 HB215 HBAgeing temperature (°C)Hardness (HB)
Approximate hardness versus ageing temperature after solution treatment (0 °C = solution-treated condition).

Values are approximate and for information only; they vary with section size, heat and furnace conditions. Binding values are determined from the manufacturer’s data under laboratory conditions.

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